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Saws / Abrasive Cutting Systems
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EXAKT develops and produces precision cutting systems and are specialized in cutting difficult materials and material composites.
Twenty years of experience in precise and gentle cutting makes us a competent partner even if your materials require very special processing. With our abrasive cutting systems, we are the world market leader in medical business sectors. Our know-how for industrial applications is gathered through close cooperation with universities and ersearch institutions. Today, our saws are used in material research and development, quality control, production and medical implant research.
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The first EXAKT diamond band saw was created using a cutting band impregnated with diamonds. Behind this was the idea to cut mineralized bones, teeth, tissue and biomaterials made of metal and plastic withut destroying the materials combined at their interface. We were successful in providing the developers of biomaterials with a better way to prepare their samples for subsequent microscopic analysis.
Due to the technological development also in other industrial areas an every increasing number of material composites are used. The list of separable material composites and thus the areas of application of our saws have been extended dramatically. In response to this we are continously improving and extending our saws according to your needs.
In 1995 EXAKT presented the first cutting system based on the "contact point" method, the so-called MCP (minimum contact point). We use this method for our cutting systems as it allows us to provide optimum solutions for cutting difficult materials and material composites.
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Grinders
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| Based on the cutting systems, EXAKT developed their grinders. Thin sections of samples which can then be stained and analyzed are needed in medical implant research and histology. Ths requires an excellent surface quality and perfect plane parallelism - and this with samples with a thickness of 20 µm or less! Irregularities in the material structures are not permissible and the material junctions in the interface have to be preseanted clearly. REsulting from the consequent commitment to these objectives we can now offer you our highly precise grinders. They can be used for target grinding and to produce thin sections with a material thickness < 20 µm. |
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